SEPANIUM (Mold-Release Aluminum Foil)
Summary
This mold-release material consists of aluminum foil which has been surface-treated with mold-release film.
The main usage is in the lamination process for printed wiring boards, to prevent the pre-preg (an adhesive sheet) from adhering to the SUS board.
Features
-
Clear Coating
-
Matte Coating
| Clear Coating | Ra | Rz |
|---|---|---|
| Flow Direction | 0.1[μm] | 0.5[μm] |
| Lateral | 0.1[μm] | 0.5[μm] |
| Matte Coating | Ra | Rz |
|---|---|---|
| Flow Direction | 0.4[μm] | 3.7[μm] |
| Lateral | 0.5[μm] | 3.9[μm] |
Usage
- ・Separation material layered over the pre-preg of printed wiring boards
- ・Carrier material for use in film casting methods
