We can plate silver, gold, nickel, tin and others onto all kinds of fine powders.
The functionality and design possibilities for these have been evaluated highly and we are a top class manufacturer in Japan in many sectors.
With conventional technologies, the particles were plated in an agglomerated state. This meant that after they were broken up, there were many areas on each individual particle that had not been plated and they did not function correctly.
Technology to plate fine particles whilst dispersing them to prevent agglomeration.
■Functions are imparted by completely covering the surface with the plating layer.
■There are hardly any unplated areas on the surface of the particles after they are broken up.
Plating technology to disperse and precipitate metals on the base material surface as nanoparticles.
■The surface area increases dramatically and the chemical reactivity is raised.
■A synergistic effect is obtained between the physical properties of the base material particles and the metal particles of the plating.
Multi-layer plating is also possible on fine particles measuring just a few microns.